Emerson at PACK EXPO 2019

Discover Emerson's leading portfolio of packaging technologies and expertise.

Ensure Your Packaging Lines Meet Market Demand

Manufacturers are faced with changing consumer preferences and new competition, which threaten profitability. To remain competitive in this new landscape, manufacturers must find ways to reduce loss, ensure quality and accommodate more products.

Emerson’s connected manufacturing allows you to gain real-time insight into equipment performance so you can prevent or resolve issues on the line while reducing costly product losses. Emerson also offers innovative process and package solutions that leverage powerful, cost-effective automation technologies for more precise control, shorter changeovers, improved OEE, and less material waste.

Date: September 23 - 25, 2019

Location: Las Vegas, Nevada

Booth Number: Lower South Hall - LS-6107

In the Emerson Booth

The Emerson exhibit features demonstrations of technologies that can help connect your plant with decision support and analytics, control systems to maximize production and innovative package and process solutions to increase flexibility, improve reliability and ensure quality while enhancing safety and reducing waste. Featured demonstrations include:

  • Machine and Process Health Monitoring
  • Control Solutions
  • Clean in Place Systems
  • Smart Pneumatics Monitoring
  • Real-time leak detection
  • Hygienic instrumentation
  • Ultrasonic Food Welding and Cutting
In addition, you’ll have the opportunity to speak with our packaging industry experts and learn how Emerson’s full portfolio of packaging solutions can help your operations meet market demand.