In static switching applications, power designs focus on minimizing conduction losses, optimizing thermal behavior, and achieving compact and lightweight systems while ensuring high quality at a low cost.

Infineon Technologies AG introduces a 62mm half-bridge and common emitter module portfolio with 1200 V TRENCHSTOP IGBT7 chips.

Infineon Technologies AG introduces two new XENSIV barometric air pressure (BAP) sensors: the KP464 and KP466, both targeted at automotive applications. While the KP464 is primarily designed for engine control management, the KP466 BAP sensor is intended for seat comfort functions.

Infineon Technologies launches Edge Protect embedded security solution, offering four security configuration categories for IoT applications with enhanced capabilities.

Digital isolators have become the preferred choice in many modern designs because of the many benefits they offer.

Infineon Technologies AG is taking over coordination of the wide-scope European research project AIMS5.0 ("Artificial Intelligence in Manufacturing Leading to Sustainability and Industry 5.0").

Infineon Technologies AG has developed CALYPSOTM move, a secure memory for contactless ticketing, to meet the specific requirements of each transport operator and authority.

To meet global climate targets, transportation must shift to more environmentally friendly vehicles such as energy-efficient electrified trains.

Infineon Technologies AG introduces the WLC1150 wireless charging transmitter IC, offering a cost-effective solution for higher wireless power transfer.

Following the introduction of the EiceDRIVER 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family.