Infineon Technologies AG introduces two new XENSIV barometric air pressure (BAP) sensors: the KP464 and KP466, both targeted at automotive applications. While the KP464 is primarily designed for engine control management, the KP466 BAP sensor is intended for seat comfort functions.

Infineon Technologies launches Edge Protect embedded security solution, offering four security configuration categories for IoT applications with enhanced capabilities.

Digital isolators have become the preferred choice in many modern designs because of the many benefits they offer.

Infineon Technologies AG is taking over coordination of the wide-scope European research project AIMS5.0 ("Artificial Intelligence in Manufacturing Leading to Sustainability and Industry 5.0").

Infineon Technologies AG has developed CALYPSOTM move, a secure memory for contactless ticketing, to meet the specific requirements of each transport operator and authority.

To meet global climate targets, transportation must shift to more environmentally friendly vehicles such as energy-efficient electrified trains.

Infineon Technologies AG introduces the WLC1150 wireless charging transmitter IC, offering a cost-effective solution for higher wireless power transfer.

Following the introduction of the EiceDRIVER 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family.

Infineon Technologies and Hi-Lo Systems, a Taiwan based IC programming and testing company announced their partnership in the area of Trusted Platform Module (TPM) security chips.

Infineon Technologies AG has changed the name of its Industrial Power Control (IPC) Division to Green Industrial Power (GIP). The semiconductor manufacturer is thus highlighting its consistent alignment with the Decarbonization and Digitalization trends. For the newly named Division, green energies are key growth drivers for the business.