Parker Launches New High Voltage Thermally Conductive Interface Pads

The CHO-THERM HV Series consists of thermally conductive interface pads designed to dissipate heat from high-power components while maintaining electrical isolation. These materials address the technical requirements of high-voltage systems, specifically for applications in electric vehicle (EV) charging infrastructure, on-vehicle power systems, and industrial motor controllers where the risk of electrical arcing or dielectric breakdown is a critical design constraint.

Technical Performance and Dielectric Strength
The series provides a thermal conductivity range between 1.1 and 3.3 W/m-K, facilitating heat transfer from active components such as CPUs, GPUs, and high-power busbars to passive cooling elements like heatsinks and vapor chambers. To prevent electrical failure in high-density layouts, the materials support breakdown voltages reaching 20 kV under DC load.

According to the ASTM D150 test method, the materials exhibit a dielectric constant as low as 0.05 at 1 MHz. Technical assessments using the Chomerics CHO-TM-TP13 standard indicate a dissipation factor down to 2.8 at 1 MHz. These metrics ensure that the interface pads minimize signal interference and energy loss in high-frequency switching environments common in modern power conversion and inversion systems.

Material Properties and Installation Requirements
For mechanical integration into a digital supply chain, the pads feature a Shore 00 hardness rating of 30–35. This low hardness allows the material to conform to uneven or textured mating surfaces under minimal compression force, which eliminates air gaps and optimizes the thermal contact resistance.

Safety and reliability standards are addressed through compliance with the UL 94 V-0 flammability rating. Furthermore, the materials are engineered for minimal outgassing to prevent the contamination of sensitive optical or electronic components in enclosed assemblies, such as high-voltage sensors and lighting arrays.

Industrial Applications and Format Options
The series is applicable to heavy-duty industrial equipment and alternative energy systems. The interface pads are available in four RoHS-compliant variants to meet specific voltage and thermal targets. Engineering teams can utilize standard sheet formats for automated high-volume processing or request custom die-cut configurations for complex geometries. For applications requiring mechanical stability during assembly, the pads can be supplied with optional pressure-sensitive adhesive (PSA) bonding.

Edited by Evgeny Churilov, Induportals Media - Adapted by AI.

www.parker.com