eInfochips Launches Reference Development Platform based on NXP^® i.MX 93 Applications Processor

The EIC-i.MX93-210 is an RDP kit based on NXP's i.MX 93 applications processor, featuring Arm^® Cortex^®-A55 Core and EdgeLock^® secure enclave.

“As an early access partner for the NXP i.MX 93 platform, eInfochips is proud to offer our clients a cutting-edge reference development platform. This platform enables customers across smart home, smart city and industrial verticals to quickly prototype their ideas and bring them to reality”, says Parag Mehta, chief sales, and business development officer at eInfochips.

The RDP enables developers to kick-start the development of creating more capable high-performance, cost-effective, and energy-efficient machine learning applications. As engineers progress in their product development journey, eInfochips can support them in accelerating time to market with its 25-plus years of ER&D experience. eInfochips’ expertise spans across hardware development, firmware, edge-AI enablement, end-to-end design and manufacturing.

The next-generation NXP i.MX 93 processor is a robust innovation that provides new use cases and opens a new gateway to a faster, more secure, powerful, and advanced edge-based system for industrial automation, smart home and intelligent appliances, smart buildings and automotive applications.

“NXP’s i.MX 93 applications processor combines both a level of performance and low power that will enable a wide range of innovative edge devices. EInfochips’ RDP will enable a wide range of customers to rapidly prototype and move into production,” said Jeff Steinheider, vice president and general manager, Industrial Edge, NXP.

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