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Intel News
INTEL’S NEW FAB IN IRELAND BEGINS HIGH-VOLUME PRODUCTION OF INTEL 4 TECHNOLOGY
Intel deploys extreme ultraviolet lithography in high-volume manufacturing; use of the technology in Ireland is a first for mass production in Europe.
Production tools fill the cleanroom of Fab 34, the newest Intel manufacturing facility in Ireland. On Sept. 29, 2023, Intel announced that the factory in Leixlip, Ireland, was in high-volume production of computer chips using Intel 4 technology. (Credit: Intel Corporation)
Intel celebrated the arrival of its Intel 4 technology, which uses extreme ultraviolet (EUV) technology, and the first use of EUV in high-volume manufacturing (HVM) in Europe. The arrival of this important moment ushers in the future for products like Intel’s upcoming Intel® Core™ Ultra processors (code-named Meteor Lake), which will pave the way for AI PCs, as well as future-generation Intel® Xeon® processors coming in 2024 and produced on the Intel 3 process node.
EUV technology employed in the production of Intel 4 is broadly adopted in leading-edge semiconductor technology nodes that power the most demanding computing applications, such as artificial intelligence (AI), advanced mobile networks, autonomous driving, and new data centre and cloud applications. EUV plays a critical role in driving Intel toward its goals of delivering five nodes in four years and regaining leadership in process technology by 2025.
A More Sustainable, Resilient and Secure Global Supply Chain
The opening of Fab 34 in Leixlip, Ireland, combined with Intel’s planned wafer fabrication facility in Magdeburg, Germany, and planned assembly and test facility in Wrocław, Poland, will help create a first-of-its-kind end-to-end leading-edge semiconductor manufacturing value chain in Europe. As the home for industries at the vanguard of technology – AI, telecommunications, data centres, automotive and others – Europe needs a resilient leading-edge semiconductor supply chain. Intel is committed to helping Europe realize its technological ambitions and, in turn, to building a global semiconductor supply chain that is resilient and geographically balanced.
The process development and early HVM on Intel 4 technology – which delivers significant improvements in performance, power efficiency and transistor density compared with earlier technologies – was performed in Intel’s development fab in Oregon.
Intel’s Ambitious Environmental Commitment: A Sustainable Path Forward
Intel is committed to expanding its operations while minimizing its environmental footprint. The company released its Ireland Climate Action Plan, which details efforts to reduce greenhouse gas (GHG) emissions, energy use, water use and waste to landfill.
Leixlip’s Fab 34 is on track to achieve LEED® Gold certification. The new facility incorporates several design innovations for increased sustainability. For example, the buildings will be using a 9-to-1 ratio of heat generated by heat recovery to heat generated by traditional methods, and the majority of cement used during construction was characterized as low carbon due to the integration of recycled content.
The Leixlip campus continues to implement the electricity purchasing strategy for 100% renewable supply, returns 88% of its water to the River Liffey and, in 2022, sends 0.6% of its total waste to landfill. These efforts support Intel’s corporate goals to achieve 100% renewable electricity use across its global operations, net positive water and zero waste to landfills by 2030; net-zero GHG emissions across global operations by 2040; and net-zero upstream GHG emissions by 2050.
Intel celebrated the arrival of its Intel 4 technology, which uses extreme ultraviolet (EUV) technology, and the first use of EUV in high-volume manufacturing (HVM) in Europe. The arrival of this important moment ushers in the future for products like Intel’s upcoming Intel® Core™ Ultra processors (code-named Meteor Lake), which will pave the way for AI PCs, as well as future-generation Intel® Xeon® processors coming in 2024 and produced on the Intel 3 process node.
EUV technology employed in the production of Intel 4 is broadly adopted in leading-edge semiconductor technology nodes that power the most demanding computing applications, such as artificial intelligence (AI), advanced mobile networks, autonomous driving, and new data centre and cloud applications. EUV plays a critical role in driving Intel toward its goals of delivering five nodes in four years and regaining leadership in process technology by 2025.
A More Sustainable, Resilient and Secure Global Supply Chain
The opening of Fab 34 in Leixlip, Ireland, combined with Intel’s planned wafer fabrication facility in Magdeburg, Germany, and planned assembly and test facility in Wrocław, Poland, will help create a first-of-its-kind end-to-end leading-edge semiconductor manufacturing value chain in Europe. As the home for industries at the vanguard of technology – AI, telecommunications, data centres, automotive and others – Europe needs a resilient leading-edge semiconductor supply chain. Intel is committed to helping Europe realize its technological ambitions and, in turn, to building a global semiconductor supply chain that is resilient and geographically balanced.
The process development and early HVM on Intel 4 technology – which delivers significant improvements in performance, power efficiency and transistor density compared with earlier technologies – was performed in Intel’s development fab in Oregon.
Intel’s Ambitious Environmental Commitment: A Sustainable Path Forward
Intel is committed to expanding its operations while minimizing its environmental footprint. The company released its Ireland Climate Action Plan, which details efforts to reduce greenhouse gas (GHG) emissions, energy use, water use and waste to landfill.
Leixlip’s Fab 34 is on track to achieve LEED® Gold certification. The new facility incorporates several design innovations for increased sustainability. For example, the buildings will be using a 9-to-1 ratio of heat generated by heat recovery to heat generated by traditional methods, and the majority of cement used during construction was characterized as low carbon due to the integration of recycled content.
The Leixlip campus continues to implement the electricity purchasing strategy for 100% renewable supply, returns 88% of its water to the River Liffey and, in 2022, sends 0.6% of its total waste to landfill. These efforts support Intel’s corporate goals to achieve 100% renewable electricity use across its global operations, net positive water and zero waste to landfills by 2030; net-zero GHG emissions across global operations by 2040; and net-zero upstream GHG emissions by 2050.
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