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05
'23
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Intel News
SIEMENS AND INTEL TO COLLABORATE ON ADVANCED SEMICONDUCTOR MANUFACTURING
New collaboration will advance factory efficiency and sustainability while supporting global industry ecosystems.
Cedrik Neike (left), CEO of Digital Industries and member of the Managing Board of Siemens AG, and Keyvan Esfarjani, executive vice president and chief global operations officer at Intel Corp., pose for a photo outside Intel’s headquarters in Santa Clara, California, in December 2023. (Credit: Intel Corporation)
Siemens AG, a leading technology company, and Intel Corporation, one of the world’s largest semiconductor companies, have signed a memorandum of understanding (MoU) to collaborate on driving digitalization and sustainability of microelectronics manufacturing. The companies will focus on advancing future manufacturing efforts, evolving factory operations and cybersecurity, and supporting a resilient global industry ecosystem.
The MoU identifies key areas of collaboration to explore a variety of initiatives, including optimizing energy management and addressing carbon footprints across the value chain. For instance, the collaboration will explore use of “digital twins” of complex, highly capital-intensive manufacturing facilities to standardize solutions where every percentage of efficiency gained is meaningful.
The collaboration will also explore minimizing energy use through advanced modelling of natural resources and environmental footprints across the value chain. To gain more information on product-related emissions, Intel will explore product- and supply chain-related modelling solutions with Siemens that drive data-based insights and help the industry accelerate progress in reducing its collective footprint.
Sustainable practices across the entire semiconductor life cycle, including design, manufacturing, operation, efficiency and recycling, are critical for meeting growing demand for powerful, sustainable chips. Technology has the power to accelerate solutions to reduce computing-related climate impacts across the technology industry and the rest of the global economy. Automation and digitalization hold the key to addressing the challenges as the industry drives toward net-zero greenhouse gas emissions. By combining their strengths and expertise, Siemens and Intel are poised to lead the way in driving positive change.
Siemens AG, a leading technology company, and Intel Corporation, one of the world’s largest semiconductor companies, have signed a memorandum of understanding (MoU) to collaborate on driving digitalization and sustainability of microelectronics manufacturing. The companies will focus on advancing future manufacturing efforts, evolving factory operations and cybersecurity, and supporting a resilient global industry ecosystem.
The MoU identifies key areas of collaboration to explore a variety of initiatives, including optimizing energy management and addressing carbon footprints across the value chain. For instance, the collaboration will explore use of “digital twins” of complex, highly capital-intensive manufacturing facilities to standardize solutions where every percentage of efficiency gained is meaningful.
The collaboration will also explore minimizing energy use through advanced modelling of natural resources and environmental footprints across the value chain. To gain more information on product-related emissions, Intel will explore product- and supply chain-related modelling solutions with Siemens that drive data-based insights and help the industry accelerate progress in reducing its collective footprint.
Sustainable practices across the entire semiconductor life cycle, including design, manufacturing, operation, efficiency and recycling, are critical for meeting growing demand for powerful, sustainable chips. Technology has the power to accelerate solutions to reduce computing-related climate impacts across the technology industry and the rest of the global economy. Automation and digitalization hold the key to addressing the challenges as the industry drives toward net-zero greenhouse gas emissions. By combining their strengths and expertise, Siemens and Intel are poised to lead the way in driving positive change.
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