hema electronic shows platform for customized electronics design at VISION
Hema electronic presents its solutions for embedded vision electronics at VISION 2024 (October 8-10, Messe Stuttgart).
These electronics are the heart of data processing in systems with numerous cameras and other sensors, deployed for example in special vehicles, autonomous robots or machine vision applications. For faster and more cost-effective development of such electronics, the Aalen-based company has designed its modular Embedded Vision Platform. Based on predefined building blocks for typical functionalities and state-of-the-art FPGA modules, it delivers maximum computing power for low-latency, sensor fusion and complex image processing. The modular concept enables scalable product variants and upgrades during the life cycle.
As an expert in highly complex FPGA projects, hema electronic offers solutions for applications in which signals from up to 24 cameras and other sensors are processed and in which one or more powerful System on Modules handle complex computing applications, even in real time and with mission-critical requirements. A new feature is the integration of MIPI CSI-2 cameras with the AMD Kria platform. This gives customers even more flexibility in their choice of camera sensors. hema is an AMD Adaptive Computing Partner Premier and one of the few developers of mainboards for the AMD Kria platform at the highest partnership level. Customers benefit from exclusive access to tools and resources related to the AMD Kria environment and the close cooperation between the two companies in the development of new products.
In its projects, hema electronic combines the experience of over 45 years in the electronics industry and over 30 years in the field of embedded vision with the latest technologies. The company supports customers from the project idea and development through the production of prototypes to series hardware and throughout the entire life cycle. Typical annual production volumes are in the range of 1-1000 electronics, which hema electronic can produce economically thanks to efficient processes and strategies.
Special features include the Fastlane Boardservice and the modular hema Embedded Vision Platform, which together ensure the fastest possible development of individual electronics and significantly shorter project times. The use of identical parts in different projects and the active and continuous monitoring of obsolescence risks throughout the entire life cycle lead to maximum availability of production-ready electronics, even in difficult delivery situations and over many years. In cooperation, hema expands the expertise of its customers according to their individual requirements; on request, the embedded vision specialist can also take on the testing of hardware and software as well as the assembly of complete devices.
www.hema.de
