Tria introduces first HMM-RLP module featuring COM-HPC Mini form factor at Embedded World 2025
New super-small module includes 13th Gen Intel® Core™ processor.
www.tria-technologies.com
Tria Technologies launches the Tria HMM-RLP module, featuring the COM-HPC Mini form factor, at Embedded World. This first member of Tria’s COM-HPC Mini modules is ideal for system designs that require outstanding performance and flexible IO connectivity in the smallest possible space.
The module is based on the 13th Gen Intel® Core™ H-, P, or U-series processors, offering high-end, scalable CPU compute performance on a small form factor. This enables system designers to pick from a variety of energy efficient and performance options scaling up to fourteen cores and twenty threads at 15 to 35W thermal design power. In addition, the Intel Iris® Xe Graphics Engine with up 96 execution units helps accelerating graphics, media and AI intensive tasks.
“Embedded World will provide an opportunity for us to showcase how we are enabling customers to upgrade computational performance and functionality in system designs with restricted space and cooling,” said Daniel Denzler, Senior Director, Business Line Manager, Tria Technologies. “That’s what makes this particular board ideal for mission critical equipment that has to operate 24/7 even under extreme environmental conditions. This considerably broadens our product portfolio to support key markets in automation, robotics, medical, and transportation,” Denzler added.
Equipped with soldered memory of up to 64GB, in-band ECC data protection, and optional local NVMe, the module underlines its capabilities in demanding applications.
The board features a great variety of high-speed IO including PCI Express® Gen 4, USB4, USB3.2, USB2.0, dual Gb Ethernet, MIPI-CSI, SATA, and serial ports. Multiple display options allow connecting up to four external displays via DDI, eDP, and USB4 interfaces, carrying four independent display streams.
Tria ensures long-term availability of the product, designed and manufactured in Germany. Further investment protection is provided with 100% compliance to the COM-HPC open industry standard. System solutions can easily benefit from performance and technology upgrades by migrating to future module generations, when they become available.
Demonstrations of the new module and more can be seen on Tria’s booth in Hall 3A Booth 225 during Embedded World from 11–13 March 2025 in Nuremberg, Germany.
www.tria-technologies.com
