ZEISS invests in Lidrotec to revolutionize chip singulation

ZEISS Ventures is pleased to announce its participation in a successful $13.5 million Series A-2 financing round of Lidrotec, a technology start-up specialized in laser systems for chip cutting. The round was co-led by Lam Capital and Goose Capital, alongside new investors such as ZEISS Ventures and NRW.BANK. Lidrotec will accelerate its product development and commercialization efforts with the investment, enabling it to expand its team and deliver novel liquid-mediated laser dicing solutions to both the compound semiconductor and leading-edge semiconductor markets.

Lidrotec is a deep tech company pioneering next-generation laser systems for high-precision, low-damage chip cutting. Founded with a vision to revolutionize chip singulation, Lidrotec’s innovative technology combines fluid-based cooling and cleaning with its proprietary laser systems, reducing material damage, heat-affected zone width and particle defects. This results in dramatically lower breakage rates and higher yields, particularly for difficult-to-dice hard materials and thin semiconductors.

"This funding is a major validation of our technology, team and vision," says Alexander Igelmann, Co-Founder and CEO of Lidrotec. "The support from both leading financial and strategic partners gives us the firepower to scale globally and help address the pressing inefficiencies in chip production."

www.zeiss.com