Molex has developed multi-gigabit technologies designed to keep data flowing swiftly and securely within vehicles and while enabling delivery to the cloud.
Advantech, a leading embedded computing solution provider, announced the release of its latest new 1U THIN barebone system with 8th Gen. Intel® Core™ processors up to 65W TDP – EPC-T2286
Global engineering technologies company, Renishaw, is evaluating a potential reorganisation of its additive manufacturing (AM) business by co-locating its AM engineering, marketing and commercial activities at its New Mills headquarters site in Gloucestershire, UK.
At TCT 2019, 3D Systems (NYSE:DDD) will showcase its latest additive manufacturing solutions for plastics and metals; helping customers scale their digital manufacturing workflows.
The new Direct GPS-over-Fiber (GPSoF) solution from HUBER+SUHNER is the first of its kind to facilitate a fiber optic connection to be made directly onto an antenna eliminating the need for a separate power line.
Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces its Flash CMOS image sensor family, specifically tailored for 3D laser profiling/displacement applications and high speed, high resolution inspection.