Mersen has engineered a single-component architecture that combines alternating and direct current protection to streamline circuit design within the digital supply chain.
Emerson will present integrated motion, pneumatic, and electric automation systems supporting advanced machine design and high-performance OEM applications.
Schnaithmann and Gessmann cooperate on the integration of mobile robots to increase flexibility in material logistics for industrial assembly automation.
The company is highlighting newly launched LNP THERMOCOMP OFM compounds, which are well-suited for high-power, high-voltage electric drive and power module applications.
NVIDIA & Doosan Group establish a strategic engineering initiative to deploy physical intelligence models across production automation networks and the automotive data ecosystem.
Acquisition expands LFB Group’s air handling capabilities, accelerates innovation in energy-efficient solutions, and reinforces its presence in key European markets.