Cambridge, UK – Datapaq will be at the enova 2013 exhibition in Paris in hall 7.2, at stand G43. The manufacturer of temperature measurement and analysis systems for almost any industrial heat treatment process presents a dedicated portfolio for the electronics industry. Reflow Trackers pass through SMT processes along with the printed circuit boards, compiling detailed temperature profiles and, if required, providing data for real-time monitoring via radio. Suitable for reflow soldering processes, wave, vapor phase, and selective soldering, as well as rework stations, the systems help reduce reject rates and increase yield. The accompanying Easy Oven Setup (EOS) software can automatically determine the optimal oven recipe for specific products as well as facilities, rendering consecutive test runs unnecessary and thereby saving much time and effort. Moreover, a variety of data loggers and thermal barriers enables the manufacturer to configure suitable systems for any process irrespective of space constraints, process duration, or maximum temperatures. Datapaq also supplies alternatives to test circuit boards: a sensor fixture and a wave solder pallet. Both support high repeatability, allowing users to fulfill the documentation requirements of the automotive industry, for instance.
Nutrition & Santé is Europe's leading maker of organic and health foods. Biscuits roll off its production lines in stacks of 4 or 5 units that are then wrapped in packs and inserted in their cardboard packaging at high speed.
The Schaffner Group further broadens its product offering of solutions for the improvement of power quality. The popular active harmonic filters ECOsine® Active are now also available for 3-phase TN and IT 500 – 690 V power grids.
Tool identification using Balluff Industrial RFID increases efficiency, as it makes incorrect tool allocation or missing tools a thing of the past. All the tool-relevant data are stored without contact on a data carrier embedded in the tool holder. Automatic loading into the system memory means all the data are always correct and up-to-date. Because the data are continuously updated when the tool is loaded and unloaded. In modern production facilities this ensures maximum tool utilization and high machine uptime.
Cambridge, UK – Manufacturers of ceramic molds for aerospace superalloys have to conduct regular furnace surveys to verify that reheat furnaces comply with the NADCAP AMS 2750 specification. Requirements for temperature sensors and analysis systems are also laid down by the industry standard. Datapaq is one of the few providers of temperature monitoring solutions who can ensure AMS 2750E compliance. The company has designed a dedicated solution for reheat furnaces that provides exact, real-time temperature data from inside the process. A high-temperature barrier protects a Tpaq21 data logger with an internal radio transmitter. The customized thermal barrier is suitable for repeated use in the furnace surveys which take up to eight hours and reach maximum temperatures of 1,250 °C. The accompanying software generates AMS 2750E compliant process reports. The Datapaq solution enables energy savings through the optimization of furnace parameters. Maintenance efforts and downtimes are also reduced.