07
'23
Written on
Rohde & Schwarz
07
'23
Written on
Panasonic Industry News
JOINT RESEARCH ON ULTRA-LIGHT EMC SHIELDING MATERIAL DEVELOPMENT WITH JAXA
In a joint project of "JAXA Space Exploration Innovation Hub Center", Panasonic Industry Co., Ltd. is developing an ultra-light EMC shielding material technology.
06
'23
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Fraunhofer News
Optimizing production processes through modularization
Researchers at the Fraunhofer Institute for Material and Beam Technology IWS have developed SURFinpro, a solution that uses artificial intelligence and optical measurement technology to detect, classify and visualize defects in real time, and report them to the plant carrying out the production.
06
'23
Written on
Solar Edge News
SolarEdge Introduces Solar-Attached EV Management Solution for the Commercial and Industrial Segment
SolarEdge Technologies, has announced the launch of a solar-attached Electric Vehicle (EV) management solution for the Commercial and Industrial (C&I) segment.
06
'23
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Voith News
Voith is commissioned to rebuild PM 4 at Viana
Voith has commissioned DS Smith to rebuild its PM 4 at its Viana site in Northern Portugal to increase production capacity and efficiency. The mill produces 400,000 tons of kraftliner and top kraftliner per year.
06
'23
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Elektror News
Noise protection, active cooling and vibration de-coupling of high-pressure fans
The new BOX from Elektror provides a complete solution for high-pressure applications.
06
'23
Written on
Rohde & Schwarz
Automotive Testing Expo Europe 2023: Enabling the next level of ADAS with test & measurement solutions from Rohde & Schwarz
At Automotive Testing Expo Europe 2023 in Stuttgart, Rohde & Schwarz will demonstrate a wide range of cutting-edge test solutions that support automotive applications.
06
'23
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Southco
SOUTHCO INTRODUCES NEW EJECTORS FOR E1.S SOLID STATE DRIVES
Southco has expanded its line of inject/eject mechanisms with a new line to fit the E1.S form factor.
06
'23
Written on
DFI
DFI Integrates Intel Virtualization Technology into Embedded Solutions
DFI is devoted to developing AI edge computing products. Embedded solutions effectively reduce basic equipment and utilize more existing resources.
06
'23
Written on
Kontron News
