SICK has launched the safeVisionary2, the world’s first compact 3D time-of-flight camera with safety certification performance level c, in accordance with ISO 13849.
Infineon Technologies and Hi-Lo Systems, a Taiwan based IC programming and testing company announced their partnership in the area of Trusted Platform Module (TPM) security chips.
Omron Electronic Components Europe has extended its sealed basic switch portfolio, with devices delivering the smallest comparable solution in the industry and offering multi-angle operation in an IP67-rated sliding-contact package.
The next stage of Industry 4.0: With the "Manufacturing-X" initiative, the Industry 4.0 platform is creating a sovereign data space across industries and companies - with the aim of enabling multilateral cooperation along supply chains and taking digital value creation processes to a new level.