12
'20
Written on
Eberspacher News
12
'20
Written on
Schindler News
Schindler to provide vertical transportation for the Grand Paris Express
Schindler announces it has been selected to deliver and install 134 elevators for 16 new stations and 21 ancillary facilities of the Grand Paris Express, the largest transport project in Europe that will double the size of the Paris metro network. Once in operation, Schindler elevators will help transport up to 2 million passengers a day.
12
'20
Written on
MEDIAWORLD
Read the last issue for free
https://issuu.com/ipmediaonline/docs/25_industry_emea_jul20
12
'20
Written on
FESTO News
AI Champions Baden-Württemberg: Festo wins
Festo's AI solution "Intelligent pneumatic runtime monitoring" was honoured at the "AI Champions Baden-Württemberg" awards ceremony of the Baden-Württemberg Ministry of Economics, Labour and Housing on 11 August.
12
'20
Written on
Rohde & Schwarz
Rohde & Schwarz significantly enhances 5G device certification capabilities with the R&S TS8980 test system
Rohde & Schwarz fulfills the certification entry criteria (CEC) for a greatly increased number of the Global Certification Forum's (GCF) work items (WI) and PCS Type Certification Review Board (PTCRB) requests for 5G FR1 RF conformance testing. Thanks to 572 new GCF validations and 215 new PTCRB validations for the R&S TS8980FTA 3A, the updated version of the leading RF test system R&S TS8980 can now perform a broad range of 5G device certification tests.
12
'20
Written on
Stratasys News
STRATASYS WINS ONE OF ITS LARGEST EVER AEROSPACE ORDERS FOLLOWING AM CRAFT INVESTMENT IN FOUR LARGE-SCALE 3D PRINTERS
Purchase of four Stratasys F900 3D Printers underscores growing demand for additive manufacturing in aircraft interior production.
12
'20
Written on
TE Connectivity News
TE Connectivity’s AMPMODU 2 mm wire-to-board crimp receptacles and shrouded headers free up space on printed circuit boards
TE Connectivity (TE), a world leader in connectivity and sensors, is freeing up valuable space on printed circuit boards (PCBs) for design engineers with its new compact AMPMODU wire-to-board receptacles with crimp contacts and shrouded headers. With centerline distances of 2 mm, they occupy 38 percent less space on a PCB than connectors with a 2.54 mm [0.100”] centerline.
12
'20
Written on
ICS News
New Solar Energy Optics technology transforms solar industry economics
The Solar Energy Optics (“SEO”) film solution developed by ICS is one of the key outcomes from comprehensive industrial research and development around light guide technology.
12
'20
Written on
SCHUNK News
Sensitive toolholder
SCHUNK is entering a new era of toolholding: In September, delivery of the sensory hydraulic expansion toolholder iTENDO, the most sensitive toolholder on the market, will begin.
11
'20
Written on
FLIR Systems Trading Belgium BVBA
