Infineon showcases embedded hardware solutions for computing, sensing, and power management in robotics, software-defined vehicles, and intelligent edge infrastructure.

The AI-driven solution optimizes heating and cooling in large facilities to reduce energy consumption by up to 30 percent.

The new microcontrollers combine advanced real-time control with Post-Quantum Cryptography for secure industrial systems.

New Smart Power Fab doubles production capacity for power semiconductors and analog technologies serving AI, automotive and energy applications.

Infineon introduces the AIROC UWB TSL100 chip family for secure automotive and industrial access applications.

Infineon and VinRobotics are collaborating to develop humanoid robot platforms using semiconductor, AI, and robotics technologies.

Infineon Technologies and NVIDIA collaborate to implement post-quantum resilient cryptographic hardware on the Jetson Thor platform for industrial robotics applications.

Infineon signs long-term Power Purchase Agreements (PPA) with PNE AG and Statkraft for wind farms in Brandenburg and solar parks in Spain, supporting 100% green electricity and CO2-neutral goals.

New 25 V and 40 V devices deliver higher efficiency, reliability, and power density for switching and motor-drive applications in industrial and consumer markets.

XHP 2 1700 V IGBT5 modules with .XT interconnect enhances efficiency, reliability, and service life, enabling Goldwind’s 4.5 MW turbines to stabilize grids and lower energy costs.