Temperature profiling for HACCP-compliant process validation

Temperature profiling in industrial heat treatment

Cambridge, UK – Datapaq will be at the enova 2013 exhibition in Paris in hall 7.2, at stand G43. The manufacturer of temperature measurement and analysis systems for almost any industrial heat treatment process presents a dedicated portfolio for the electronics industry. Reflow Trackers pass through SMT processes along with the printed circuit boards, compiling detailed temperature profiles and, if required, providing data for real-time monitoring via radio. Suitable for reflow soldering processes, wave, vapor phase, and selective soldering, as well as rework stations, the systems help reduce reject rates and increase yield. The accompanying Easy Oven Setup (EOS) software can automatically determine the optimal oven recipe for specific products as well as facilities, rendering consecutive test runs unnecessary and thereby saving much time and effort. Moreover, a variety of data loggers and thermal barriers enables the manufacturer to configure suitable systems for any process irrespective of space constraints, process duration, or maximum temperatures. Datapaq also supplies alternatives to test circuit boards: a sensor fixture and a wave solder pallet. Both support high repeatability, allowing users to fulfill the documentation requirements of the automotive industry, for instance.

Cambridge, UK – Manufacturers of ceramic molds for aerospace superalloys have to conduct regular furnace surveys to verify that reheat furnaces comply with the NADCAP AMS 2750 specification. Requirements for temperature sensors and analysis systems are also laid down by the industry standard. Datapaq is one of the few providers of temperature monitoring solutions who can ensure AMS 2750E compliance. The company has designed a dedicated solution for reheat furnaces that provides exact, real-time temperature data from inside the process. A high-temperature barrier protects a Tpaq21 data logger with an internal radio transmitter. The customized thermal barrier is suitable for repeated use in the furnace surveys which take up to eight hours and reach maximum temperatures of 1,250 °C. The accompanying software generates AMS 2750E compliant process reports. The Datapaq solution enables energy savings through the optimization of furnace parameters. Maintenance efforts and downtimes are also reduced.

Cambridge, UK – Pipes used in the oil and gas industry need to withstand high pressures. Manufacturers must verify temperature uniformity during heat treatment which is performed in a special furnace while the pipes are rotated. Depending on the thickness and grade of the steel, a cycle lasts up to 90 min at about 950 °C with maximum temperatures reaching 1,000 °C. Since rectangular thermal barriers designed with conventional thermal protection cannot be installed in the pipes due to size and performance constraints, an entirely new approach was required. Based on its unrivaled experience in the development of specialized thermal protection solutions, Datapaq has designed a cylindrical vapor phase barrier for this application. The TB4095 thermal barrier is combined with a Tpaq21 data logger, and the Furnace Insight software. Through thermocouples placed at various points across the pipe surface, temperature uniformity of the product can be proven. After the system had been in operation for a short time at a pipe manufacturer’s site, changeover time for differently sized pipes was reduced and process faults within the furnace were identified and corrected, thereby reducing waste.

Cambridge, UK – For optimal temperature control in rotational molding processes, Datapaq now provides the RotoPaq system which can collect data directly from inside the oven, mold surface, and even within the mold. The data logger, thermal barrier, and thermocouples are attached to the rotating mold assembly to record temperature data throughout the continuous heating and cooling cycles. In addition to being stored in the logger, the data can be transmitted in real time using radio telemetry. The temperature profile enables users to control and optimize the process in order to avoid common manufacturing defects such as warping, pinholes/bubbles, discoloration, and uneven impact resistance, thus ensuring both high product quality and efficiency. The RotoPaq system is routinely used to validate new materials and processes or when environmental conditions change. Its excellent thermal protection allows continuous operation for up to 14 hours. Datapaq also provides thermal barriers for use in water shower cooling. The Insight analysis software enables quality control certification for customers or according to industry standards such as QS9000.

Cambridge, UK – Datapaq has customized a temperature profiling solution for vapor phase soldering for an electronics supplier to the automotive, aerospace, military, and medical industries. The comeback of vapor phase soldering (or condensation reflow) as an efficient technology for small batches of high-value electronic assemblies calls for state-of-the-art quality assurance measures without the drawback of trailing sensor cables. Accordingly, the DQ1862 data logger and the corresponding thermal barrier have been developed for inline application. Both being extra small, they can simply be placed inside the carrier tray along with SMD packages. The logger records a detailed temperature profile of the complete pre-heat and vapor soldering process. The accompanying Insight software provides for in-depth analysis and clear visualization. The system is used to compare the performance of different machines and ensure that all are optimized, contributing to minimal reject rates. Without trailing thermocouple cables, profiling is now conducted safely, quickly, and easily. Based on the Datapaq solution the customer has reduced setup times considerably.

Cambridge, UK – Extending the Oven Tracker XL2 system, Datapaq introduces the new and improved MicroMag thermocouple designed for use in automotive paint monitoring. Working extensively with key automotive paint operations worldwide, Datapaq has further extended the operating capability of the popular MicroMag thermocouple. The new encapsulated magnet design allows reliable direct use during production, even on wet painted and e-coated substrates. It eliminates any risk of either magnet damage or magnet loss when the probe is removed from a cured paint surface at the end of the oven process. The miniature surface and air thermocouple which employs state-of-the-art samarium-cobalt magnet technology can be placed into the tightest of recesses. It is therefore ideal for car body shell areas that are difficult to access. Due to its low thermal mass, the MicroMag provides response characteristics that challenge those of exposed junction thermocouples while it has the additional advantage of quick and easy attachment to ferrous substrates. Despite its compact size, 17 mm in diameter, the magnet ensures secure hold up to the maximum experienced paint and powder coating cure temperatures. An aluminum knob for easy routine rugged handling, even when wearing gloves, can be removed, if necessary, to suit application requirements.

Cambridge, UK – Datapaq provides the first ever temperature profiling system specifically for glass tempering processes. It uses thermocouples to take measurements from the glass sheet while passing through the tempering furnace. The Furnace Tracker system for glass tempering furnaces accurately measures temperatures from all types of glass including hard and soft-coated low-E glass. Thus, users can optimize cycle times and reduce energy costs. The system includes a choice of fast-response type-K thermocouples that can be cemented to the glass sheet under test. Up to four thermocouples are attached to a DQ1840 data logger which records detailed temperature profiles. The logger is protected from the heat of the furnace by a low-height thermal barrier designed especially for glass tempering furnaces. The TB7528 thermal barrier measures a mere 29 mm in height with a 430 x 220 mm footprint.

Cambridge, UK – Working with a tier 1 electronics supplier to the automotive industry, Datapaq has tailored a temperature monitoring solution for documenting the repeatability of selective soldering processes. This development has become necessary as automotive manufacturers are increasingly requiring their suppliers to perform statistical process control. The economic argument for immediate quality control is strong, too: since margins are small in this industry segment, and the costs of product failures are high, measuring and controlling each process ensures profitability. Datapaq’s low-cost solution monitors both the pre-heat stage and the dip soldering stage and generates detailed temperature profiles that enable users to compare the performance of different machines, adjust parameters if necessary, and reduce setup time for new batches. Crucially, the system is small and light enough to pass through the process along with the printed circuit boards. It consists of a Q18 data logger and a PA2200A fixture holding two thermocouples for the pre-heat stage and three thermocouples for the dip soldering stage. The dip soldering probes enable the monitoring of solder temperature as well as dwell time in the solder (contact time). They can be adjusted to allow for measurement of contact time at different heights. The customer uses Datapaq products to monitor all soldering processes. In addition to minimizing training costs, this facilitates the establishment of best practices since central process development engineers can compare measurements from all their assembly facilities.