Introducing New Open Standard Modules and Edge Computing Platforms

ADLINK will be debuting its OSM product line of embedded modules in a versatile standard for small-size and low-cost soldered-down including the OSM-IMX93 (NXP i.MX 93), OSM-IMX8MP (NXP i.MX 8M Plus) at Embedded World 2024, Hall 3, Booth 147.

ADLINK Technology will be at Embedded World 2024 to showcase its responses to trends in the embedded market. Launching at the show will be the new OSM product line featuring versatile standards for small-size and low-cost soldered-down embedded modules that are fully machine processable during soldering, assembly and testing. New Edge Computing Platforms will also be debuted which integrate leading technologies from Intel^®, NVIDIA^®, and Arm^® for industrial applications. ASD+ industrial-grade high-performance Enterprise SSD family series will also be introduced.

“The new COM embedded modules represent the latest evolution in performance, safety and reliability and our new Edge Computing Platforms showcase our expanding expertise in embedded hardware - delivering the versatility needed for the challenging industrial and robotics applications of today,” said Roy Wan, CEO ADLINK EMEA. “As a Titanium Tier member of the Intel^® Partner Alliance, ADLINK collaborates with industry leaders like AUO^® to ensure the highest quality products, facilitating fast time-to-market. This commitment to delivering the industry-leading edge visualization solutions will be on full display at Embedded World 2024.”

The ADLINK booth with feature the full range of ADLINK embedded solutions including:
New Computer-on-Modules:
In addition to the OSM-IMX93 (NXP i.MX 93), OSM-IMX8MP (NXP i.MX 8M Plus) ADLINK will also be showcasing the COM Express Type 6 cExpress-MTL module. Based on Intel Core Ultra processor with integrated Intel^® Arc™ GPU, it offers up to 8 GPU Xe-cores (128 EUs) - almost doubling graphics performance compared to previous generation offerings. The SMARC LEC-IMX95 module, based on NXP i.MX 95 SoC, is a high-performance, safety enabled platform with eIQ^® Neutron NPU for light edge AI applications.

Pioneering Edge Visualization Solutions:
ADLINK's edge visualization solutions are designed to empower users with enhanced vision and processing capabilities. Visitors to the booth will be able to learn more about the Human-Machine Interface (HMI), designed with the advanced Intel^® Core™ IP69K stainless steel panel PC (Titan2) which is ideal for the food and beverage industry. The NXP^® ARM-based panel PC (SP2-IMX8) offers superior connectivity, with a dual 4K fanless palm-size media player (EMP-100) ensuring 24/7 content display.

The booth will also feature the recently launched NVIDIA^® Ada Lovelace MXM GPU module, AD2000, and the Intel^® A380E PEG card. Visitors can also experience live demonstrations for Pocket AI, a generative AI software, and interactive AI assistant for smart retail applications, showcasing the seamless integration of hardware and software solutions.

Industry-Leading Edge Computing Platforms:
Integrating leading technologies from Intel^®, NVIDIA^®, and Arm^® ADLINKs new Edge Computing Platforms for industrial applications feature the the reliable Industrial PC (IPC) series, including SBC 3.5" and AmITX models, and the versatile MVP family of fanless embedded computers with the latest MXE-230 IoT platforms. Addressing the evolving needs for AI and robotics applications is the DLAP-411-Orin Edge AI Platform and RQX-59 ROS 2 Robotic Controller. Also debuting is the ASD+ industrial-grade high-performance Enterprise SSD family series, reinforcing ADLINK's commitment to dependable storage.

ADAS Solutions for autonomous driving computing platforms:
A new demo for Embedded World 2024 will highlight ADLINK’s AI-ADAS solution for commercial vehicles, which includes surround-view monitoring and a driver monitor system.

IST_Streamline IIoT Integration for Manufacturing and Energy:
Visitors to the booth will be able to explore the latest IIoT solutions for the manufacturing and energy sectors. Highlights include an AI smart camera based on NVIDIA Jetson Orin Nano, designed for automated defect detection in packaging to enhance productivity. The newly launched EMU-200 Arm-based IIoT gateway, which features built-in EGiFlow data flow setting software, demonstrates seamless data transmission to facilitate solar energy monitoring and energy distribution for EV chargers. The showcase will also feature a PXI controller powered by 11th Gen Intel CPUs and a latest high-power, high-computing PXI platform with DAQ modules, offering high-performance and high-precision measurement solutions.

Complete solutions for networking & communications:
ADLINK diverse 5G and industrial edge computing solutions will be available to view demos and displays including the MicroRAN, an all-in-one private 5G solution that empowers small and medium enterprises to upgrade traditional factory set ups with smart manufacturing. ADLINK will also showcase compact, anti-shock/vibration/corrosion and low acoustic noise MECS series edge servers with Intel 4th Gen Xeon processors family for industrial edge computing applications.

Rugged computing solutions for high industry standards
The CompactPCI, CompactPCI Serial, VPX, and PC104, featuring advanced CPU and GPU technologies will all be at Embedded World 2024. Enabling edge AI applications in sectors such as railway, defense, industrial automation, and outdoor scenario, the portfolio comprises COTS, ruggedized, and vertical-certified platforms, ensuring reliability, longevity, and integration with the latest AI technology for mission-critical applications.

www.adlinktech.com

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