GE Hitachi Nuclear Energy (GEH) and TerraPower have announced a collaboration to pursue a Public Private Partnership to design and construct the Versatile Test Reactor (VTR) for the U.S. Department of Energy (DOE).
Balluff’s new wafer mapping sensor, BOH00EZ, utilizes a highly precise photoelectric sensor for quick and reliable detection of semiconductor wafers and slotting errors in FOUPS – front opening unified pods.
ABB and Ericsson, together with Swisscom, showcase for the first time, how easily and effectively robots can be controlled over wide distances utilizing the real-time communication capabilities of 5G.
If the weight of PCD tools is reduced, as a rule significantly higher cutting data can be used. Along with design freedom, the possibility of weight optimisation is one of the crucial advantages offered by 3D printing. Due to the specially developed structures inside the tool, which cannot be manufactured conventionally, the weight can be reduced significantly.