Hengstler recently developed and introduced a paper clip as a presenter alternative, when the use of a presenter is not possible due to space availability and limitation inside a kiosk or to keep the cost of the total system as low as possible. The paper clip is a small clip made out of thin metal that can be used for receipt paper, tickets, labels with liner, or other materials. The inexpensive feature that can be ordered either with the printer or as accessory.
Fluke Process Instruments has developed a miniature monitoring solution for monoblock cure processes. The DATAPAQ MonoPaq2 system profiles the metal temperature of coated aluminum bottles, aerosols, and collapsible tubes both in IBO and OBO lines. The thermal barrier measures merely 41 x 48 x 195 mm, making it 43% smaller by volume than the preceding generation. The temperature profiling system can be used in lines with very closely spaced pins (>45 mm) and with various product basket sizes. This engineering success is primarily based on the development of a new data logger with a minimal footprint. The new DATAPAQ Q18 logger connects four thermocouples via micro-miniature sockets and logs up to 32,000 readings per channel with an adjustable interval of 0.05 s or more. Its accuracy of ±0.5 °C puts it squarely in the class of the best available loggers.
Wider temperature range, new application areas
Fluke Process Instruments has added four new single-color and two-color pyrometers to the Endurance series. The series now covers measured temperatures from 50 °C to 3,200 °C. The manufacturer has enhanced the maximum optical resolution from 150:1 to 300:1, enabling measuring of even smaller targets from a distance. A new low-temp ratio pyrometer for demanding applications measures temperatures from 250 °C. The sensors feature galvanically isolated inputs/outputs and a stainless steel IP65 housing.
Following extensive research and development, Morgan Advanced Materials has successfully produced two new materials which offer superior performance and higher casting yields when used in injection-moulded ceramic cores for the aerospace market.