Reconfigurable intelligent surfaces (RIS) are drawing attention in the wireless industry due to their potential for an efficient 5G mmWave rollout as well as future 6G applications.
Global technology, software and engineering leader Emerson will exhibit its Floor to Cloud packaging solutions at PACK EXPO Las Vegas, September 11-13, 2023. As the future of automation, Floor to Cloud solutions empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.
In his first European public appearance as President and COO of DENSO, the Fortune 500 advanced automotive technology supplier, Shinnosuke Hayashi revealed that the business plans to invest €63 billion (¥10 trillion) in research and development over the next ten years in line with its pursuit of zero emissions and zero traffic fatalities within mobility and society.
Sivers Semiconductors has received an initial order from Vector Photonics for the evaluation of epitaxial material for a new, next-generation surface coupling laser project.
Mouser Electronics, Inc, is now shipping the VN Series pressure sensors from Superior Sensor Technology. The VN Series sensors are a comprehensive set of pressure sensors for ventilator and high-flow oxygen devices.
Carlo Gavazzi Automation, the international electronics group with activities in the design, manufacture and marketing of electronic equipment, today presents the new EM500 series 1-phase energy analyser.