Lane Electronics News

Nicomatic high-performance micro-connectors available from Lane Electronics

Lane Electronics, a leading franchised distributor for many of the industry’s major electrical and electronic connector manufacturers, can supply a wide range of Nicomatic high-performance micro-connectors from stock.

Schaeffler News

Schaeffler develops hydrogen mobility for commercial vehicles

Schaeffler’s focus on drive systems for commercial vehicles includes hydrogen technology, especially for long-haul applications. The company is developing innovative components for fuel cell systems and laying the groundwork for them to be produced on an industrial scale.

Actia News

ACTIA’S ENERGY EQUIPMENT IS INTEGRATED INTO THE LARGEST ENEDIS TRAINING CENTRE

The protection system of the Digital Control-Command Protection project (DCCP from the Relyance range) developed by the Energy division of ACTIA Telecom, the group’s Telecom division, is integrated into the largest ENEDIS training centre: the La Pérollière campus (Rhône). This is an opportunity for the 20,000 trainees expected on the campus by 2024 to learn about HTB/HTA source substation jobs using ACTIA equipment.

Temposonics News

One sensor with IO-Link and eight positions to measure? Now possible!

Temposonics, company of the Amphenol Group, announces the expansion of the Temposonics® E-Series IO-Link for industrial applications. These linear position sensors with IO-Link are now available with multi-position measurement, enabling the detection and output of up to eight positions simultaneously.

Schlumberger News

Olivier Le Peuch on digital’s role in the low carbon energy future

Olivier Le Peuch has been both a witness and a participant in the industry’s digital evolution over his thirty-five-year career at Schlumberger. Today, as the company’s chief executive officer, he sees digital as a great “accelerator” for the industry to address the dual energy access and climate challenges the world is facing.

Siemens digital Industry Software News

Siemens collaborates with UMC to develop 3D integrated circuit hybrid bonding workflow

Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.

FESTO News

Festo: Energy efficiency, CO2 neutrality and sustainability in industrial automation

Energy efficiency, CO2 neutrality and sustainability are topics that concern you? And you want and need to act? In this live stream, we will show you concrete product examples, solution approaches as well as useful engineering tools for energy-efficient machine design.

Komatsu

Komatsu Europe HD785-8 Rigid Dump Truck at bauma 2022

EU Stage V compliant - Excellent manoeuvrability and travel performance. Visit Komatsu at bauma 2022 in hall C6 and on the outdoor demo ground FM713/1.

Baslerweb News

Basler Announces Vision Compatibility for New NVIDIA Jetson Orin Nano Edge AI Platform

Basler will be introducing Add-on Camera Kits with 5 and 13 MP to support the NVIDIA® Jetson Orin Nano system-on-modules (SOMs), which have set a new baseline for entry-level edge AI and robotics, as announced today at NVIDIA GTC. Add-on Camera Kits are ready-to-use vision extensions that include an adapter board, camera, lens, and cables.

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