Compared to its established predecessor ID CPR40.30, the new device supports more transponder types and current security functions and also offers more performance.
Tele Columbus will create a converged interconnect network (CIN) built on Juniper’s Cloud Metro infrastructure and NEC’s xHaul transformation services.
New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm® X100 5G RAN Accelerator Card. Qualcomm® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.
Parker Hannifin has launched a new comprehensive catalogue detailing its range of Bestobell high-performance cryogenic valves used in applications for the transportation, storage, and processing of ultra-low temperature liquefied gases.
Moxa has introduced its AWK Series, a new lineup of next-generation industrial wireless networking solutions offering 802.11ac Gigabit Wi-Fi, IEC 62443-4-2 SL2 certified* security, and dual-band Turbo Roaming for unmatched wireless reliability and availability.
The Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA® Jetson Orin module series, will take centre stage at Embedded World 2023 in Hall 3, Booth 339.