VISION trade fair: Fast-track OEM serial development with VC embedded vision solutions

At the VISION trade fair in Stuttgart, Germany, Vision Components will premiere the miniaturized VC picoSmart 3D laser profile sensor. This versatile OEM component has been developed for fast-track design of economic, tailored 3D systems.

OEM components such as the miniaturized VC picoSmart 3D laser profile sensor with onboard image processing, shortly to premiere at the VISION trade fair, reduce the development effort required for new sensors and embedded vision projects

It combines two tested and proven modules developed inhouse and matched for perfect results: the world’s smallest image processing system VC picoSmart, which is fully integrated on a 22 mm x 23.5 mm board, and a line laser module.

Additional trade fair highlights include the ultracompact FPGA-based image processing booster VC Power SoM with a board footprint of only 28 mm x 24 mm and, based on it, the VC Stereo Cam. The hardware accelerator executes complex image pre-processing operations in real time, for instance color space conversion, barcode identification or data fusion from stereo vision or multicamera applications.

It allows vision OEMs a flexible choice of processor board and is easy to integrate in all kinds of embedded vision electronics designs. For series development, the VC Power SoM can be integrated into mainboard designs as a module or combined with an I/O board with multiple MIPI ports. Thus, vision OEMs achieve series maturity in less time and more efficiently. Not least, Vision Components will also present its huge and continuously growing portfolio of MIPI camera modules, including modules for SWIR and 3D/ToF applications.

www.vision-components.com

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