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Sabic News
SABIC TO EXHIBIT SPECIALTY MATERIALS FOR DATA INFRASTRUCTURES AT OFC 2025
At OFC 2025, SABIC will exhibit a range of specialty thermoplastics that are well suited for data infrastructure applications, including optics, connectors, wire & cable, and external housings.
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SABIC will exhibit at the 2025 Optical Fiber Communications (OFC) Conference and Exhibition, in Booth #6244. At the event, the company will highlight high-performance materials, including ULTEM™ and SILTEM™ resins and LNP™ ELCRES™ polycarbonate copolymers, which can help customers build robust and reliable data infrastructures. SABIC will also introduce a new EXTEM™ RH resin grade that withstands 260°C reflow soldering and whose enhanced properties support high-volume production of multi-lens arrays (MLAs) for optical interconnect assemblies and sub-assemblies. Two EXTEM resin demonstrators will be featured: a single-mode expanded beam connector assembly; and a novel process using metallization to auto-align MLAs.
New EXTEM RH1017UCL resin is well suited for emerging technologies like on-board and co-packaged optical interconnects. Compared to fused silica and thermosets, this optically transparent material can deliver greater design freedom, support scaled-up production and reduce system costs by avoiding secondary operations. This new product surpasses other EXTEM grades with improved near-infrared (IR) light transmission, lower moisture uptake and easier processing.
Besides optical interconnects and transceiver lenses, SABIC will display other data infrastructure applications – for external installations and data centers – which leverage thermoplastics:
- External fiber optic closures and splice trays are molded from NORYL™ resin or LNP ELCRES copolymer resin, which can withstand harsh outdoor conditions including extreme heat/cold, impact and weather.
- Fiber optic and electrical connectors can benefit from Superflow ULTEM resins, which enable thin-wall, miniaturized designs, and from ULTEM EPR resins, which are compatible with electroless plating processes.
- As a potential alternative to fluoropolymers, SILTEM™ resins help deliver high heat performance and easy processing in wire & cable jacketing and insulation.
Demonstrating Breakthrough Technologies
SABIC’s single-mode expanded beam connector assembly, to be showcased at OFC, was co-developed with the Tyndall National Institute. This application uses the new EXTEM RH1017UCL material, which supports micro-molding and withstands 260°C reflow soldering according to the JEDEC® protocol.
EXTEM RH1017UCL resin will also be featured in SABIC’s second demonstrator, co-developed with the Chip Integration Technology Center (CITC). It will showcase the use of an alternative interconnect technology for the optical alignment of MLAs.
OFC 2025 will be held at the Moscone Center in San Francisco, Calif., from March 30 through April 3.
SABIC’s single-mode expanded beam connector assembly, to be showcased at OFC, was co-developed with the Tyndall National Institute. This application uses the new EXTEM RH1017UCL material, which supports micro-molding and withstands 260°C reflow soldering according to the JEDEC® protocol.
EXTEM RH1017UCL resin will also be featured in SABIC’s second demonstrator, co-developed with the Chip Integration Technology Center (CITC). It will showcase the use of an alternative interconnect technology for the optical alignment of MLAs.
OFC 2025 will be held at the Moscone Center in San Francisco, Calif., from March 30 through April 3.
