On the occasion of its tenth anniversary, NORD DRIVESYSTEMS S.A. de C.V. Mexico opened a new, larger assembly plant and office in Huimilpan, in the state of Querétaro, Mexico.
Southco has expanded its DZUS® Quarter-Turn product line with the launch of a captive-style fastener that prevents over tightening. The DZUS® D9 Tech Line Quarter-Turn Fastener combines Southco’s proven quarter-turn and captive fastening technologies to create a next generation solution that provides consistent, reliable clamping force and quick access.
Fluke Process Instruments has developed a miniature monitoring solution for monoblock cure processes. The DATAPAQ MonoPaq2 system profiles the metal temperature of coated aluminum bottles, aerosols, and collapsible tubes both in IBO and OBO lines. The thermal barrier measures merely 41 x 48 x 195 mm, making it 43% smaller by volume than the preceding generation. The temperature profiling system can be used in lines with very closely spaced pins (>45 mm) and with various product basket sizes. This engineering success is primarily based on the development of a new data logger with a minimal footprint. The new DATAPAQ MicroQ18 logger connects four thermocouples via micro-miniature sockets and logs up to 32,000 readings per channel with an adjustable interval of 0.05 s or more. Its accuracy of ±0.5 °C puts it squarely in the class of the best available loggers.
Fluke Process Instruments announces the smallest thermal profiling system designed specifically for miniature wave selective soldering processes. The DATAPAQ SelectivePaq uses four thermocouples to take measurements from the electronic assembly as it passes through the preheating and dip soldering phases. Sample intervals can be adjusted to up to 20 times per second. The detailed temperature profiles enable electronics manufacturers to adjust their operations for optimum efficiency, validate the consistent quality of PCBs to customers, and prove adherence to both solder and component temperature constraints. The profiling system combines a new four-channel DATAPAQ MicroQ18 data logger with the latest micro-miniature thermocouple plugs and a low-mass thermal shield merely 20 mm high and 40 mm wide. It is therefore optimally suited to monitor the performance of machines that offer very restricted space and for use with holding frames. The complementary DATAPAQ Selective Soldering Process Sensor Array facilitates regular and frequent process stability measurements.
In 2015, the Safety Communication Layer of BiSS Safety was confirmed by TÜV Rhineland for suitability for safety-relevant communication up to and including SIL3. In the future, Hengstler will offer this protocol for its rotary encoder portfolio in order to meet the steady growth in safety applications.