11
'23
Written on
Moxa News
11
'23
Written on
Fraunhofer News
LASERS JOIN LIGHTWEIGHT SANDWICH STRUCTURES
Fraunhofer IWS has developed a process to produce lightweight panels and profiles significantly faster as well as cheaper than with conventional methods.
10
'23
Written on
Hexagon Manufacturing Intelligence News
Hexagon launches next generation ultra-high accuracy CMMs
Modular machine configurations optimised for specific applications define the new future-ready Leitz PMM-C platform.
10
'23
Written on
Wika News
Wika introduces Ultra high purity transducer
The WUD-2x-E model is a particularly compact, ultra high purity transducer for high-accuracy pressure measurement of ultrapure gases in the semiconductor industry.
10
'23
Written on
Renesas News
Renesas Cellular-to-Cloud Development Kits now connect to Microsoft Azure Cloud Services
Azure-Certified Kits Featuring both RA and RX Families of 32-bit MCUs Enable Reliable and Secure End-to-End Cloud Solutions.
10
'23
Written on
VOLLMER News
VOLLMER INVITES ITS CUSTOMERS AND PARTNERS TO THE VDAYS 2023 INDUSTRY EVENT
VOLLMER is inviting its customers and partners to the industry days event, which will take place from 18th to 20th April 2023 in Biberach.
07
'23
Written on
Turck News
TURCK HAS EXTENDED CONDITION MONITORING PLATFORM
Turck's IM18-CCM60 with the siineos operating system: condition monitoring without programming knowledge.
07
'23
Written on
EAO News
NEW EAO SERIES 09 RUGGED KEYPADS WITH 8 PUSHBUTTONS
Ideally suited for operation in outdoor applications, also under extreme conditions.
07
'23
Written on
PiL Sensoren News
PiL Sensoren P48-30 ultrasonic barrier with an optimized connection solution
The sensor specialist PiL has optimized its economical, easy-to-install P48-30 series ultrasonic sensors and now offers a common Y-connector with M12 output for the transmitter and receiver.
07
'23
Written on
Leonardo News
