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HARTING USA
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Rohde & Schwarz
Rohde & Schwarz and NOFFZ enable the next level of automotive radar production with a new efficient solution
Rohde & Schwarz introduces new options for its automotive radar target simulator R&S AREG800A. The new R&S AREG-P creates and enables an environment for a seamless transition of automotive radar sensor from R&D to production. Used standalone or as turnkey solution together with NOFFZ integrating the AREG-P into their production test systems, enables Tier1 automotive radar suppliers to increase throughput, reduce test time and optimize costs of end-of-line tests.
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Rohde & Schwarz
Rohde & Schwarz presents photonics-based ultra-stable tunable THz system for 6G at EuMW 2024
With the proof-of-concept for a system for 6G wireless data transmission based on a photonic THz communications link, Rohde & Schwarz is showcasing its contribution to state-of-the-art research for next generation wireless technologies at European Microwave Week in Paris. The ultra-stable, tunable THz system, developed within the 6G-ADLANTIK project, is based on frequency comb technology and enables carrier frequencies well beyond 500 GHz.
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NSK
NSK in load ratings breakthrough
In a world first, NSK has introduced a new method of accurately predicting the lifespan of rolling bearings based on their size and the amount of non-metallic inclusions in the steel the bearings are made from. Going forward, NSK’s Angular Contact Ball Bearings, Cylindrical Roller Bearings, Deep Groove Ball Bearings and Tapered Roller Bearings will all see their lifespans increased, potentially even doubled, by this optimisation of basic dynamic load ratings.
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ASUS News
ASUS IoT Introduces Arm-based Tinker Board 3 Single-Board Computer and Tinker System 3N for Diverse Vertical Applications
Compact power, meticulously designed for the demands of modern industry.
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Alphawave Semi News
Alphawave Semi to Showcase Latest Advances in AI Connectivity IP at ECOC 2024
Demonstrations highlighting leadership in PCIe over Optics, Ethernet, PCIe and UCIe SerDes on 3nm TSMC CoWoS packaging. Dr. Tony Chan Carusone to present workshop on I/O for AI clusters.
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IDS Imaging Development Systems GmbH
IDS Showcases Groundbreaking 2D, 3D, and AI-Based Vision Systems at SPS 2024 in Nuremberg, Germany
Innovative Industrial Cameras for Robotics and Process Automation to Take Center Stage at Stand 6-360.
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Honeywell News
HONEYWELL AND SAMSUNG E&A PLAN COLLABORATION TO HELP REDUCE POWER PLANT EMISSIONS
The agreement aims to provide customers a carbon capture solution for power plants from two leading energy solution providers.
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Siemens News
MERCK AND SIEMENS ENTER STRATEGIC PARTNERSHIP ON DIGITAL TRANSFORMATION TECHNOLOGY
Siemens was named one of the global preferred suppliers for Merck's next-level automation, boosting global smart manufacturing with Siemens Xcelerator platform.
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SICK News
