ASRock Industrial is thrilled to announce the launch of its latest innovation, the SBC-262M-WT 3.5” SBC Motherboard, a new benchmark in edge computing, powered by the advanced Intel® Atom® x7433RE Processor (Amston Lake).
Metsä Group has entered into an extensive cooperation with international technology group ANDRITZ to conduct a pre-study for the first possible commercial mill producing the Kuura textile fiber.
The European Open Testing and Integration Centre (OTIC) in Berlin, located at the Deutsche Telekom innovation campus facilitated by i14y Lab, provides high-quality and comprehensive testing for O-RAN-based products and solutions as well as validation and integration services to a supply chain of open radio access network vendors.
New AVP with industry-leading size, weight, and power (SWaP) runs Teledyne FLIR’s Prism AI and ISP software libraries enabling drone, robot, and security camera payloads.
Kontron a leading global provider of IoT/Embedded Computer Technology (ECT), expands its existing SMARC portfolio with a module that features the i.MX8M Plus processor with two GbE interfaces and two CAN interfaces.
In collaboration with partners including Cisco, Ericsson, Microsoft, ODVA, the OPC Foundation and NVIDIA, Rockwell will showcase the latest technologies at Hannover Messe 2024.
Grid solutions rolled out from GEAT are expected to support the integration of renewable as Algeria diversifies its energy mix towards a lower carbon future.