04 {{ "2026-06-04T00:00:00+00:00" | date "MMM" }} '26

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Datalogic S.p.A.

Datalogic and Pensa Systems bring AI-powered Visual capabilities to Mobile Computers across the Retail Supply Chain

Running on Datalogic’s Memor™ 35 and existing mobile devices, the solution transforms data capture into real-time visual intelligence from shelf to warehouse—automating up to 70% of in-store and supply chain audit activities.

Read more…

04 {{ "2026-06-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-04T00:00:00+00:00" | date "longDate" }}

Infineon News

Hardware Security Integration for Autonomous Physical Artificial Intelligence Systems

Infineon Technologies and NVIDIA collaborate to implement post-quantum resilient cryptographic hardware on the Jetson Thor platform for industrial robotics applications.

Read more…

04 {{ "2026-06-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-04T00:00:00+00:00" | date "longDate" }}

R+L Hydraulics News

High-Temperature Elastomer Couplings for Industrial Drive Systems

R+L Hydraulics manufactures continuous-operation coupling elements designed for extreme thermal environments up to 177 degrees Celsius.

Read more…

04 {{ "2026-06-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-04T00:00:00+00:00" | date "longDate" }}

Tezmaksan News

Automated CNC Vise Loading System for Low-Volume Production

Tezmaksan has developed a compact robotic automation system designed to handle vise loading and positioning for high-mix machining environments.

Read more…

04 {{ "2026-06-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-04T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics Introduces Intelligent Vibration Sensor for Industrial Monitoring

IIS3DWB10IS provides the first compelling alternative to piezosensor for condition monitoring, combining performances, lightweight design, ease of integration, ultra-accuracy, and energy efficiency.

Read more…

04 {{ "2026-06-04T00:00:00+00:00" | date "MMM" }} '26

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AMD News

OQC, JPMorganChase, and AMD Establish Quantum-AI Platform

OQC, JPMorganChase, and AMD collaborate to deploy a dedicated Quantum-AI Data Centre in London for testing financial computing applications.

Read more…

04 {{ "2026-06-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-04T00:00:00+00:00" | date "longDate" }}

Nvidia News

TSMC Deploys NVIDIA Accelerated Computing and AI in Fabs

TSMC is integrating NVIDIA AI and accelerated computing platforms to optimize semiconductor design, manufacturing, and defect inspection workflows.

Read more…

03 {{ "2026-06-03T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-03T00:00:00+00:00" | date "longDate" }}

ALTHEN News

Althen Expands Partnership with Jewell Instruments to France and the UK

At Althen we are very pleased to announce the expansion of our long-standing partnership with Jewell Instruments. With this new agreement, Althen becomes the official Sales Partner for Jewell Instruments in France and the United Kingdom.

Read more…

03 {{ "2026-06-03T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-03T00:00:00+00:00" | date "longDate" }}

Voith News

Bulk-Saving Calendering for Board Production

Voith develops a web-conditioning process that reduces fiber demand while maintaining board stiffness, printability, and surface performance.

Read more…

03 {{ "2026-06-03T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-06-03T00:00:00+00:00" | date "longDate" }}

Siemens News

Siemens Expands Capital Software with 3D Electrical Design Capabilities

The added features permit electrical and mechanical engineers to work concurrently within a shared 3D context, facilitating interdisciplinary collaboration and decreasing late-stage design modifications.

Read more…

Market Overview

Solar Power for Manufacturing Industries

Technical Articles

Quality Assurance Beyond Visual Inspection in Food & Beverage Manufacturing

Case studies

Substitution of Chemical Biocides by Electrolysis in the Paper Industry

Datalogic and Pensa Systems bring AI-powered Visual capabilities to Mobile Computers across the Retail Supply Chain

Running on Datalogic’s Memor™ 35 and existing mobile devices, the solution transforms data capture into real-time visual intelligence from shelf to warehouse—automating up to 70% of in-store and supply chain audit activities.

Hardware Security Integration for Autonomous Physical Artificial Intelligence Systems

Infineon Technologies and NVIDIA collaborate to implement post-quantum resilient cryptographic hardware on the Jetson Thor platform for industrial robotics applications.

High-Temperature Elastomer Couplings for Industrial Drive Systems

R+L Hydraulics manufactures continuous-operation coupling elements designed for extreme thermal environments up to 177 degrees Celsius.

Automated CNC Vise Loading System for Low-Volume Production

Tezmaksan has developed a compact robotic automation system designed to handle vise loading and positioning for high-mix machining environments.

STMicroelectronics Introduces Intelligent Vibration Sensor for Industrial Monitoring

IIS3DWB10IS provides the first compelling alternative to piezosensor for condition monitoring, combining performances, lightweight design, ease of integration, ultra-accuracy, and energy efficiency.

OQC, JPMorganChase, and AMD Establish Quantum-AI Platform

OQC, JPMorganChase, and AMD collaborate to deploy a dedicated Quantum-AI Data Centre in London for testing financial computing applications.

TSMC Deploys NVIDIA Accelerated Computing and AI in Fabs

TSMC is integrating NVIDIA AI and accelerated computing platforms to optimize semiconductor design, manufacturing, and defect inspection workflows.

Althen Expands Partnership with Jewell Instruments to France and the UK

At Althen we are very pleased to announce the expansion of our long-standing partnership with Jewell Instruments. With this new agreement, Althen becomes the official Sales Partner for Jewell Instruments in France and the United Kingdom.

Bulk-Saving Calendering for Board Production

Voith develops a web-conditioning process that reduces fiber demand while maintaining board stiffness, printability, and surface performance.

Siemens Expands Capital Software with 3D Electrical Design Capabilities

The added features permit electrical and mechanical engineers to work concurrently within a shared 3D context, facilitating interdisciplinary collaboration and decreasing late-stage design modifications.

International