ADLINK Technology Inc., a global leader in edge computing, announces its partnership with Altium, a leader in PCB design software, to offer a fully automated SMARC carrier design process to its customers, leveraging Upverter -- a web-based drag-and-drop designer tool.
A new radio wave-based analysis technology, developed by the Finnish high-tech company Collo, makes it possible to continuously monitor the state of any liquid in industrial processes, be it thick slurries, resins, adhesives, coatings, emulsion, beer, water or any other fluid.
International technology Group ANDRITZ has launched the ecoOne, a new pusher centrifuge based on the proven Krauss-Maffei pusher centrifuge technology and with a powerful single motor fulfilling multiple functions.
On March 24, 2021, Comau's Wearable Robotics Specialist Cayla Zielinski will present the latest product in Comau's wearable exoskeleton line, MATE-XT in a webinar hosted by the Wearable Robotics Association (WearRA).
NXP Semiconductors N.V. (NASDAQ: NXPI) and Morgan Stanley & Co. LLC will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative edge processing solutions for the Industrial & IoT end-market.
CEA-Leti, a technology research institute of CEA Tech, will present 14 papers during Photonics West 2021, March 6-11, including an invited paper, "Advanced roughness characterization for 300mm Si photonics patterning & optimization".