Designed to compensate for installation deviations, vibration, and thermal expansion, the mechanism supports efficient liquid cooling deployment at scale.
Rheinmetall develops a new electrode technology for alkaline electrolysis within Germany’s National Hydrogen Strategy, targeting higher efficiency and scalable green hydrogen production.
Telit Cinterion and Nokia are collaborating to integrate multi-access wireless connectivity with in-network edge computing for mission-critical industrial operations.
The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing™ SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.
Rosenberger Optical Solutions & Infrastructure implements large-scale AI data centre cabling projects across Europe in cooperation with a leading AI computing provider and end customer Microsoft.
Aerotech Inc. introduces the AGV-CPO 2-axis laser scan head to extend high-performance galvo scanning to a broader range of laser micromachining applications.
Innolux presents next-generation display technologies integrating MicroLED and naked-eye 3D to support retail, cockpit, and smart device applications at CES 2026.
Exxelia has developed a new Smart Integrated Magnetics solution designed for advanced power conditioning and distribution units (PCDUs) operating in constrained and demanding environments such as space systems.
Together, Datalogic and Digimarc are supporting retailers’ efforts to improve the checkout experience while reducing gift card fraud and helping brands protect consumer trust at the point of sale.
Schaeffler will present intelligent motion systems for robotics, energy, automation, and vehicles at CES 2026, highlighting the role of data-rich components in AI-enabled industrial transformation.